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GONIOMETER

  • Over 40 years experience in the manufacture of production grade x-ray systems.

  • Several hundreds of equipement in operation around the world.

  • Standard or customized equipment for all applications.

GM Series

■    Orientation measurements

  • Face of any crystal (Si wafer, quartz plate, bar, etc.)

  • Wafer flat

  • Wafer notch

■    Orientation processes

  • Flat location on small ingotWafer flat

  • Quartz bar before cutting

  • Special orientations on various crystals

Several versions

  • for loads up to 10kg

  • for loads up to 25kg

  • special version for loads up to 100kg

  • Custom made versions

  • Dual-station, including mixed versions with GM.WS or GM.SI station below

Several versions

  • Decimal : resolution 0.01°

  • Degrees, minutes, seconds : 1 or 5 sec

  • PC and software : decimal and deg.min.sec.

       Standard or customized software.​

       Storage of measured data

Several versions

± 15 to 30 seconds, depending of configuration

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Goniometer software

GM.WS Series

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Software Goniometer for ingot

■    Ingot orientation prior to wire saw cutting

  • Sotfware assisted orientation process

  • Storage of measurement and orientation data

■    Measurement and orientation of ingot axis

  • Special process and additional equipment available for preparation of "on-axis" OD grinding of ingots

       (Data sheet on request)​

■    Determination of <110> directions on <111> ingots

  • Information on request

 

Accuracy

  • Goniometric measurements : ±0.01°

  • Ingot orientation process : better than ±0.05°

Software

The software performs the orientation calculation in such a way that the ingot remains horizontal on the saw holder.

The operator is guides by the software during the orientation process.

Locks inhibit process progress until proper action is taken.

Models/capacities

  • Several models are available to cover a large range of applications with ingot diameters from 2" to 300mm and lenght up to 550mm

  • Special / customized models on request

  • Mixed dual-station versions, with above GM or GM.SI station as a second station

GM.SI Series

■    Orientation measurements

  • Ingot flat

  • Ingot notch

  • Seed orientation (round or square seeds)

  • Wafer face

  • Wafer flat

■    Orientation processes

  • Flat & notch on "as grown" ingots

  • Flat & notch on ground ingots

  • Special orientations on various crystals

Models / Capacities

  • GM.SI 10 : Ingot diameter 75 to 250mm

  • GM.SI 12 : Ingot diameter up to 300mm

  • Ingot lenght up to max 800mm or 85kg

 

Options

  • Angular display of ingot rotation

  • Angular display options as above GM series

Configurations

The GM.SI series X-ray goniometer systems are designed for operation in combination with grinding equipment. The flat or notch orientation position found on the X-ray machine must be transferres to the grinder.

  • Several orientation transfer configurations can be offered to suit most grinding and ingot holding systems. 

       Description of various procedures on request.

  • Mixed dual-station versions, with GM or GM.WS station as a second station.

Performance

  • X-ray detection : ±0.01°

  • Orientation process :±0.03° to 0.05° , depending of configuration

  • Measurements : ±0.01° to 0.03°

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A dedicated data sheet is available for each equipment.

Operation principe, orientation procedure, process description also available on request.

Goniometer gmsi operation & process
Legend operation process for goniometer
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